Citation
The Ongoing Challenge – A Responsive Enterprise-Wide Demand Supply Network for Semiconductor Based Package Goods – Something for Everyone. In proceedings of the 5th Multidisciplinary International Conference on Scheduling : Theory and Applications (MISTA 2011), 9-11 August 2011, Phoenix, Arizona, USA, pages 10-93, 2011.
Paper
Abstract
Most organizations, from health care facilities to semiconductor manufacturing, can be viewed as an ongoing sequence of loosely coupled decisions where current and future assets are matched with current and future demand across the demand-supply network at different levels of granularity ranging from placing a lot on a tool (dispatch) to an aggregate capacity plan across a five-year horizon. By itself, this creates a substantial challenge to management and the computational intelligence community to put in place applications that enable a firm to respond quickly and intelligently to changes in demand and/or assets. The nature of semiconductor manufacturing adds such features as re-entrant flow, alternative bill of materials, repair actions; variability in capacity, long and short lead times, variability in demand, lead time versus utilization trade-off, et al to the “challenge pile”. This presentation will outline the basic playing field and challenges at the global planning level, the factory planning level, the dispatch level, and coordination between these three levels. Additionally, it will briefly describe some recent advances.
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Bibtex
@INPROCEEDINGS{2011-010-093-P, author = {K. Fordyce},
title = {The Ongoing Challenge – A Responsive Enterprise-Wide Demand Supply Network for Semiconductor Based Package Goods – Something for Everyone},
booktitle = {In proceedings of the 5th Multidisciplinary International Conference on Scheduling : Theory and Applications (MISTA 2011), 9-11 August 2011, Phoenix, Arizona, USA},
year = {2011},
editor = {J. Fowler and G. Kendall and B. McCollum},
pages = {10--93},
note = {Paper},
abstract = {Most organizations, from health care facilities to semiconductor manufacturing, can be viewed as an ongoing sequence of loosely coupled decisions where current and future assets are matched with current and future demand across the demand-supply network at different levels of granularity ranging from placing a lot on a tool (dispatch) to an aggregate capacity plan across a five-year horizon. By itself, this creates a substantial challenge to management and the computational intelligence community to put in place applications that enable a firm to respond quickly and intelligently to changes in demand and/or assets. The nature of semiconductor manufacturing adds such features as re-entrant flow, alternative bill of materials, repair actions; variability in capacity, long and short lead times, variability in demand, lead time versus utilization trade-off, et al to the “challenge pile”. This presentation will outline the basic playing field and challenges at the global planning level, the factory planning level, the dispatch level, and coordination between these three levels. Additionally, it will briefly describe some recent advances.},
owner = {gxk},
timestamp = {2011.08.15},
webpdf = {2011-010-093-P.pdf} }